Facilities & Capabilities

SRI’s MSEL operates two 5000-sq.-ft MEMS fabrication facilities; one in Largo, FL, and one in Menlo Park, CA. In addition, MSEL has over 13,000 sq. ft of engineering space to support the following capabilities:

Solid model of MEMS device

MSEL clean room facility

SEM image of wire bonding on MEMS device

MSEL analytical facility

Design and Modeling

• Mask layout and solid model creation using computer-aided design.
• Finite element multi-physics modeling
• Process development
• Rapid 3-D printing for prototype visualization

Process and Packaging Capabilities

• Thin-film patterning and lithography
• Laser patterning and ablation
• Advanced resist plating technology
• RIE and DRIE etching
• Silicon processing and bulk micromachining
• Thin/thick film deposition
• Conductive: Au, Ag, Al, Cr, Ir, Mo, Ni, Pt, Si, Sn, Ti, W, Zr, ITO, iridium oxide and more
• Dielectrics: silicon dioxide, -nitride, silicon oxynitride, alumina and more
• Polymers and composites
• Microwave enhanced plasma chemical vapor deposition of: nanocrystalline diamond films, intrinsic and nitrogen-doped; microcrystalline films  
• Spatially selective chemical vapor deposition
• Substrates: up to 6” silicon, glass, ceramics, polymers
• Device packaging: wafer-to wafer bonding, chip bonding, die packaging, wire bonding

Analysis and Testing Capabilities

• Scanning electron microscopy with EDAX
• Focused ion beam milling
• Optical microscopy
• Interface/film/device characterization
• Surface profilometry
• Atomic force microscopy and stylus profilometry
• White light noncontact topography
• Dynamic motion analysis with custom waveforms
• UV-Vis-IR spectrophotometry
• Wafer and chip electrical probing
• Vacuum probing, micro-nano manipulation