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SRI International's MicroScience Engineering Laboratories

Staff Bios

John Bumgarner, Ph.D., Director
Director of research and operations in a MEMS group targeting development of chemical, optical, and acoustic microsensors and MEMS devices for environmental and underwater applications. Previously: director of the MEMS fabrication laboratory for the University of South Florida; vice president of Engineering at Kyma Technologies, Raleigh, NC, a high-tech startup developing bulk GaN for optoelectronic applications; process integration group leader at Intel Corp for startup of Fab22 at 0.13µm generation with Cu interconnects, process integration group leader for Fab12, team leader for Portland Technology Development Yield Group for development of 0.13µm generation, and process integration development engineer for 0.18 and 0.25µm generations. Ph.D. in Materials Science and Engineering, North Carolina State University, Raleigh, NC, under Prof. Bob Davis, working in wide band-gap semiconductor growth and device fabrication. M.S. and B.S. in Materials Science and Engineering from Northwestern University, Evanston, IL.

Scott Samson, Ph.D., Principal Engineer
Optical MEMS sensor and communication device design, fabrication, and testing; physical MEMS for atmospheric and ocean sensing. Experience leading projects and developing sensor systems for underwater applications and free-space optical communications. Experience in developing MEMS, integrated optics, electromechanical and optomechanical systems.

Weidong Wang, Ph.D., Principal Engineer
MEMS focal plane array (FPAs) for IR imaging; MEMS acoustic sensor arrays for ultrasonic imaging; optical MEMS; modeling and simulations of sensors and packaging using finite element analysis (FEA); MEMS, multichip module, and 3D packaging; integrated optics, optical waveguides, modulators and switches; microsensors for environmental monitoring; surface acoustic wave (SAW) sensors; MEMS energy harvesting and electric power management.

Paul R. Schwoebel, Ph.D., Sr. Research Engineer
Ion and electron sources; surface science; surface analysis; field ion and electron microscopy; atom-probe microscopy; scanning and transmission electron microscopy; auger electron microscopy; time-of-flight mass analysis; high-voltage engineering; cryogenic engineering; ultra-high-vacuum and vacuum-tube techniques; neutron sources for active interrogation systems; high-brightness field-ion sources for direct-write ion-beam lithography; large-area, high-current ion sources for light-ion inertial confinement fusion; flat-panel display technology; high-current electron sources; x-ray sources; phosphor degradation; radiation damage; plasma physics. Basic research in crystal growth and nucleation phenomena; vacuum and gaseous electrical breakdown; processes in high electric fields; low-energy ion interactions with surfaces.

Christopher Holland, Principal Scientist
MEMS device development including field emission Spindt cathodes, micro-field ion ionizers, microwave amplifiers, flat-panel displays, biosensors, microfluidics, microsensors, printer engines, microplasmas, and microthrusters. Experience in all aspects of MEMS device processing including physical vapor deposition, plasma-assisted deposition, plasma-assisted etching, photo and electron beam lithography, and microelectronic materials and device characterization.

Drew Hanser, Ph.D., Program Manager
Materials processing and device applications, with specialization in the wide-bandgap semiconductor gallium nitride; development of gallium nitride materials and substrates, including device development for LEDs, laser diodes, RF transistors, and power electronics; program interests include technologies for solid state lighting, high-power and high-efficiency electronics, materials processing, and MEMS applications.

Shinzo Onishi, Ph.D., Sr. Research Engineer
Development of PVD systems and processes; thin-film device development; hydrogen storage for automotive energy source; single-crystal growth using interface technology; commercial reactive sputtering and ICP development; integrated circuits including SAW, photonics, and semiconductors.

Priscila Spagnol, Ph.D., Sr. Research Engineer
Development and deposition of wide-band-gap materials, with emphasis on diamond films, for MEMS applications. Other areas of expertise include high Tc materials (YBCO and BCCO) and buffer layers (Ir, Ce, Y2O3 and YSZ); ferroelectric materials (PMN and PZT) and piezoelectric materials (BT and BST).

Colby Bellew, Ph.D., Sr. Research Engineer
MEMS devices, including electrostatic electron and ion emitters, micromirror arrays for telecom switching applications, resonant membranes for biological and chemical testing, micromolded polysilicon structures, and biomimetic auto-rotating sensor delivery vehicles as well as solar-powered, autonomous sensor motes and microrobots. Experience in all phases of MEMS development including design, modeling, process development, fabrication, and testing.   

Janet Stillman, Ph.D., Research Engineer
Design, simulation, fabrication and testing of MEMS, particularly 3-D microfabrication with laser-patterned photo-structurable materials and integration of microsensors and microactuators with CMOS electronics. Experience developing electric-field sensors, CMOS MEMS, resonant electromechanical processors and sensors, and process development and physical modeling for photosensitive glass.

Michelle Cardenas, Ph.D., Sr. Research Engineer
Development of MEMS sensors for in-situ water analysis and environmental monitoring; modeling and simulation of MEMS components using finite element analysis; colorimetric, optical sensors.

Gareth Dobson, Ph.D., Analytical Chemist
Development of methods, sensors. and novel analytical instruments as well as their miniaturization. Experience in analysis of biomolecules, environmental species, chemical threats and small molecules. International and national collaborations. Novel analytical methods, instruments, and applications designed to address client specific needs.

Charles "Capp" Spindt, Ph.D., (Emeritus)
Pioneering leader in vacuum microelectronics technology, field electron and ion emission devices, and high-performance field-emitter array cathodes. Invented and developed techniques for the fabrication of sub-micron size field emission sources based on thin-film technology and advanced lithography systems. The Spindt cathode is a cold cathode with 100% efficiency that produces much higher current densities than traditional thermionic cathodes. Applications include flat-panel displays, microwave tubes, spacecraft charge management, and vacuum integrated circuits. Received Society for Information Display's 1996 Jan Rajchman Prize for the invention of field emission flat panel displays.

William Chu, Research Engineer
Design and fabrication of MEMS devices, chemical sensors, magnetic sensors, biomedical devices, pressure sensors, and accelerometers. Fabrication process development for cavity-type OLED devices. Extensive experience with various thin-film deposition, chemical vapor deposition, photolithography, and reactive ion etching.

Christel Munoz, Research Engineer
Design and fabrication of optical, infrared, and multi-sensor MEMS devices; microsensor fabrication including photolithography, chemical and physical vapor deposition, e-beam evaporation, and wet and dry plasma etching. Metrology and sensor characterization using scanning electron microscopy, and optical and contact profilometry. Synthesis of semiconductor and polymeric materials.

Susana Stillwell, Research Engineer
MEMS device fabrication including photolithography, physical vapor deposition, wet etching, plasma etching; metrology and sensor characterization. Other areas of expertise include hardware testing including climatic, dynamic, and vacuum testing for extreme operating environments.

Benjamin Rossie, Research Engineer
Materials characterization, including SEM, FIB, EDS and TEM. MEMS device fabrication including photolithography, physical vapor deposition, wet etching, plasma etching, and fabrication facility management.

Tariq M. Haniff, Sr. Process Engineer
Microfabrication of MEMS and solid-state electronic devices, with specialty in plasma and DRIE etching; mask design and layout of MEMS devices. Projects have included a variety of sensors and actuators (gyroscopes, pressure sensors, optical switches, variable optical attenuators, and other torsional mirror-type devices).

Elizabeth (Libby) Tyner, Research Engineer
MEMS sensors for the marine environment; bioMEMS, especially for marine science and medical applications; design and fabrication of microcylindrical ion trap (CIT); advanced materials and coatings for inhibition of marine biofouling.

Sunny Kedia, Research Engineer
Design, fabrication, and assembly of optical MEMS sensors including corner cube retroreflector, spectrometer, and beam scanner. Other areas of interest include modeling and simulations of sensors using coventorware; development of porous silicon for various MEMS applications; magnetic MEMS and printed circuit board (PCB) design.

Patricia R. Martin, MEMS Process Engineer
Biopharmaceutical research, wafer and microfabrication disciplines. Areas of interest include microfluidics, microfabrication, IC wafer fabrication, electrophoresis, DNA sequencing and genotyping, assay development, MEMS, SEM, statistical process control, validation studies-clinical trials, DNA/RNA extraction, PCR amplification, optics, laser fluorescence, and surface chemistry.

Surjit Chhokar ,  Research Engineer
Design, fabrication, and packaging of MEMS. Areas of interest include biomedical glucose sensors, electrochemical microsensors, polymer active structures, micro-RFID devices, and space vacuum electronics. Familiar with all aspects of microfabrication, including lithography, chemical and vapor deposition. e-beam evaporation, sputtering, plasma etching, metrology, scanning electron microscopy, optical and contact profilometry, electroplating, screen printing. MEMS device design using CAD tools; device packaging and testing.

David Thibert, Research Engineer
Design and fabrication of specialized high vacuum apparatus for PVD and electron/ion optics testing. Process development and operation of a variety of PVD tools. Prototype device mounting and packaging. Facility design, project management and facility management.

Leonid Kant, Lab Facilities and Equipment Technician
Coordination and oversight of facilities, equipment, and vacuum systems. Support for projects in equipment, setup, measurements, custom electronics, mechanical devices. Equipment repair and preventive maintenance.

Shari Shepherd, Engineering Assistant
Fabrication of high aspect ratio MEMS and vacuum microelectronics. Microsensor fabrication including photolithography, wet and dry plasma etching, electrochemical pulse etching, characterization and analysis with scanning electron microscopy and EDAX equipment, contact profilometry.

Marv Simkins, Engineer
Microfabrication of MEMS devices using photolithography and wet and dry etching. Metrology including optical and IR microscopy and SEM. Interests include addressable hollow cathode plasma array sources for charge transfer, addressable arched metal spring finger arrays, addressable arrays of field emission electron sources and deflection assemblies, ion emission thruster, electron field emission devices, microfluidic devices.

 

For more information, contact:
MicroScience Engineering Laboratories
SRI International
333 Ravenswood Avenue
Menlo Park, CA 94025
Phone: 650-859-3042
info-msel@sri.com

 

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